micro commercial components 20736 marilla street chatsworth chatsworth, ca 91311 phone: (818) 701-4933 fax: (818) 701-4939 ESDA6V1L 6.1volts sot-23 features ? d ual t ransil a rray f or e sd p ro tec tion ? 2 u n idire ctional t ransil f unctions ? low leakagecurrent: irmax<20 ua at vwm ? 300w peak pulse power (8/20 u s) maximum ratings parameter symbol limits unit electrostatic discharge 25 kv mcc tm micro commercial components www.mccsemi .com 1 of 4 inches mm dim min max min max note a .110 .120 2.80 3.04 b .083 .098 2.10 2.64 c .047 .055 1.20 1.40 d .035 .041 .89 1.03 e .070 .081 1.78 2.05 f .018 .024 .45 .60 g .0005 .0039 .013 .100 h .035 .044 .89 1.12 j .003 .007 .085 .180 k .015 .020 .37 .51 a b c d e f g h j .079 2.000 in c h es mm . 03 1 .800 .035 .900 . 03 7 .950 .037 .950 k pin configuration-top view junction temperature 150 o c peak pulse power 8/20us ppp 300 w mil std 883c-method 3015-6 iec61000-4-2 air discharge iec61000-4-2 contact discharge v pp 16 kv 9 kv t j storage temperature range for soldering during 10s t stg -55~+150 o c maximum lead temperature t l 260 o c esd protection device revision:a 2011/01/01 epoxy meets ul 94 v-0 flammability rating moisture sensitivity level 1
electrical characteristics (t a = 25c unless otherwise noted) www.mccsemi .com 2 of 4 symbol parameter v wm stand-off voltage v br breakdown voltage v cl clamping voltage i rm leakage current i pp peak pulse current t voltage temperature coefficient c capacitance r d dynamic resistance v f forward voltage drop parameter test conditions symbol min typ max unit breakdown voltage i r =1.0ma v br 6.1 6.65 7.2 v leakage current v wm =5.25v i r - - 20 a capacitance 0v bias c - 140 - pf forward voltage drop i f =200ma v f - - 1.25 v mcc tm micro commercial components esd61l reision: 20110101
typical characteristics www.mccsemi .com 3 of 4 p pp (t j initial) / p pp (t j initial=25 ) p pp (w) tp (s) t j initial ( ) fig.2: peak pulse power vs. exponential pulse duration (t j initial = 25 ) fig.1: peak power dissipation vs. initial junction temperature p pp (t j initial) / p pp (t j initial=25 ) p pp (w) tp (s) t j initial ( ) fig.2: peak pulse power vs. exponential pulse duration (t j initial = 25 ) fig.1: peak power dissipation vs. initial junction temperature i pp (a) c (pf) v cl (v) v r (v) fig.3: clamping voltage vs. peak pulse current (tj initial = 25 , rectangular waveform tp = 2.5s) fig.4: capacitance vs. reverse applied voltage (typical values) i r (t j ) / i r (t j =25 ) i fm (a) t j ( ) v fm (v) fig.6: peak forward voltage drop vs. peak forward current (typical values) fig.5: relative variation of leakage current vs. junction temperature (typical values) mcc tm micro commercial components ESDA6V1L revision:a 2011/01/01
mcc tm micro commercial components www. mccsemi .com 4 of 4 revision:a 2011/01/01 device packing part number-tp tape&reel: 3 kpcs/reel ordering information : *** i m p o r t a n t n o t ic e * ** m i c r o c o m m e r c i a l c o m p on e n ts c o r p . r e s e rve s t h e r i g h t t o m a k e c h a n g e s w i t ho u t f u r t h e r no t i c e t o a n y p r o d u c t h e r e i n t o m a k e c o rr e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m pr o v e m e n t s , o r o t h e r ch a n g e s . m i c r o c o m m e r c i a l c o mp o n e n ts c o r p . d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g ou t o f t h e a p p l i c a t i on o r u s e o f a n y p r o d uc t d e sc r i be d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y li c e n s e un der i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f pr o d uc t s i n s u c h a p p l i c a t i o n s sh a l l a ss u m e a l l r i s k s o f su c h u s e a n d w ill a g r ee t o h o l d m i c r o c o mm er c i a l c o m p o n e n t s c o r p . a n d a ll t h e c o m p a n i e s w ho s e p r o d u c t s a r e r e p r e s e n t ed o n ou r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s. * * * l i f e s u p p o r t *** m c c ' s pr o d uc t s a r e n o t a u t h o r iz ed f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u pp o r t d e v i c e s o r s y s t e m s w i t h ou t t h e e x pre ss wr i tt e n a p p r o v a l o f m i c r o c o mm e r c i a l c o m p o n e n t s c o rp o r a t i o n. * * * c u s t o m e r a w a r e n e ss*** c o un t e r f e i t i n g o f s e m i c o n d u c t o r p a r t s i s a gr o w i n g p r o b l e m i n t h e i n d u s t ry . m i c r o c o mm e r c i a l c o m p o n e n t s ( m cc ) i s t a k i n g s t r o n g m e a su r e s t o p r o t e c t ou r s e l v e s a n d o u r cu s t o m e r s f r o m t h e pr o l i f e r a t i on o f c o u n t e r f e i t p a r t s . m c c s t r o n g l y e nc o u r a g e s c u s t o m e r s t o p u r c h a s e m c c p a r t s e i t h e r d i r e c t l y f r o m m c c o r f r o m a u t ho r i z e d m c c d i s t r i b u t o r s w ho a r e l i s t e d b y c o u n t r y o n o u r w e b p a g e c i t ed below . p r o d uc t s c us t o m e r s b u y e i t h e r f r o m m c c d i r e c t l y o r f r o m a u t ho r i z e d m cc d i s t r i b u t o r s a r e g e n u i n e p a r t s , h a v e f ul l t r a c e a b il i t y , m e e t m c c ' s q u a l i t y s t a n d a r d s f o r h a n d li n g a n d s t o r a g e . m c c wi l l n o t p r o v i d e a n y w a rr a n ty c o v e r a g e o r o t h e r a s s i s t a n c e f o r p a r ts b o u g h t f r o m u n a u t h o r i z e d s o u r c e s. m c c i s c o m m i t t e d t o c o m b a t t h i s g l o b a l pr o b l e m a n d e n c ou r a g e o u r c u s t o m e r s t o d o t h e i r p a r t in s t o p p i n g t h i s p r a c t i c e b y b u y i n g d i r e c t o r f r o m a u t h o r i z ed d i s t r i b u t o r s.
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